| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 18 Mar 2020 | SERC | Institute of Materials Research and Engineering | Electrodeposited Copper Micropillar Surfaces with Pulse Reverse Voltammetry for Enhanced Heat Dissipation | Jayce J. W. Cheng, Fengxia Wei, Sing Yang Chiam | ACS Applied Electronic Materials |