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Publication date Communities Collections Article title Author(s) Journal/Conference
7 Jan 2022 SERC Institute of High Performance Computing Impact velocity-dependent bonding mechanisms in metal cold spray C.D. Reddy, Zhi-Qian Zhang, S. Msolli, Junyan Guo, N. Sridhar Surface and Coatings Technology
22 Aug 2021 SERC Institute of High Performance Computing, Institute of Materials Research and Engineering, Advanced Remanufacturing and Technology Centre Prediction of Microstructure Evolution of Cold Sprayed Coatings Using a Dislocation Density Based Constitutive Model Sabeur Msolli, Zhi-Qian Zhang, Debbie Hwee Leng Seng, Zheng Zhang, Junyan Guo, C. D. Reddy, N. Sridhar, Jisheng Pan, Boon Hee Tan, Qizhong Loi Lecture Notes in Mechanical Engineering
21 Aug 2021 SERC Institute of High Performance Computing Prediction of Microstructure Evolution of Cold Sprayed Coatings Using a Dislocation Density Based Constitutive Model Sabeur Msolli, Zhi-Qian Zhang, Debbie Hwee Leng Seng, Zheng Zhang, Junyan Guo, C. D. Reddy, N. Sridhar, Jisheng Pan, Boon Hee Tan, Qizhong Loi Proceedings of the 2nd International Conference on Advanced Surface Enhancement (INCASE 2021)
24 Apr 2021 SERC Institute of High Performance Computing An experimentally validated dislocation density based computational framework for predicting microstructural evolution in cold spray process Sabeur Msolli, Zhi-Qian Zhang, Debbie Hwee Leng Seng, Zheng Zhang, Junyan Guo, C.D. Reddy, N. Sridhar, Jisheng Pan, Boon Hee Tan, Qizhong Loi International Journal of Solids and Structures
24 Apr 2021 SERC Institute of High Performance Computing An experimentally validated dislocation density based computational framework for predicting microstructural evolution in cold spray process Sabeur Msolli, Zhi-Qian Zhang, Debbie Hwee Leng Seng, Zheng Zhang, Junyan Guo, C.D. Reddy, N. Sridhar, Jisheng Pan, Boon Hee Tan, Qizhong Loi International Journal of Solids and Structures
28 Nov 2019 SERC Institute of High Performance Computing Defect-Free Electroplating of High Aspect Ratio Through Silicon Vias: Role of Size and Aspect Ratio C. A. Joshi, H. Ramanarayan, K. H. Khoo, H. Jin, S. S. Quek, D. T. Wu, N. Sridhar, M. S. Bharathi 2019 International Wafer Level Packaging Conference (IWLPC)
13 Dec 2018 SERC Institute of High Performance Computing Multiscale Models for Electroplating of Through Silicon Vias K. H. Khoo, MingRui Lai, H. Ramanarayan, Hongmei Jin, S. Wu, C. A. Joshi, K. R. Mangipudi, J. J. Cheng, S. S. Quek, D. T. Wu, N. Sridhar, M. S. Bharathi 2018 International Wafer Level Packaging Conference (IWLPC)
27 Nov 2018 SERC Institute of High Performance Computing Analysis of Cold Spray Coating Sprayed at Angles ZHI CHENG KELVIN Loke, Junyan Guo, Zhiqian Zhang, N. Sridhar, Pak Keng Koh, TEIK CHENG ALAN Lim, HONG NING PHILIP Chean, WAI ONN RICHARD KWOK Proceedings of the Asian Thermal Spray Conference, Volume IX
27 Nov 2018 SERC Institute of High Performance Computing Analysis of Cold Spray Coating Formed with Stationary Nozzle K. Loke, P.K. Koh, H.W. NG, P. Cheang, J. Guo, Zhiqian Zhang, N. Sridhar Proceedings of the Asian Thermal Spray Conference, Volume IX