| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 10 Aug 2021 | SERC | Institute of Microelectronics | Comprehensive Study of Thermal Impact on Warpage Behaviour of FOWLP with Different Die to Mold Ratio | Ser Choong Chong, Simon Siak Boon Lim, Wen Wei Seit, Tai Chong Chai, Debbie Claire Sanchez | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |