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Publication date Communities Collections Article title Author(s) Journal/Conference
24 Feb 2026 SERC Institute for Infocomm Research AI-Powered Super-Resolution for Scalable and Efficient 3D X-Ray Inspection of 3D-Stacked HBMs Yang Yu, Kangkang Lu, Jie Wang, Richard Chang, Meng Keong Lim, Ser Choong Chong, Ramanpreet Singh Pahwa, Xulei Yang 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
24 Feb 2026 SERC Institute of Materials Research and Engineering Anomalyspy: A Generative Defect Localization in Semiconductor Packages, with X-Ray Microscopy Riko I Made, Pawan Kumar, Pablo Quijano Velasco, Ng Chee Koon, Leong Chang Jie 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
18 Jan 2023 SERC Institute for Infocomm Research Improved Bump Detection and Defect Identification for HBMs using Refined Machine Learning Approach Wang Jie, Richard Chang, Xu Xun, Cai Lile, Chuang Sheng Foo, Ramanpreet Singh Pahwa 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
12 Jul 2022 SERC Institute for Infocomm Research Automated Detection and Segmentation of HBMs in 3D X-ray Images using Semi-Supervised Deep Learning Ramanpreet Singh Pahwa, Richard Chang, Wang Jie, Xu Xun, Oo Zaw Min, Foo Chuan Sheng, Chong Ser Choong, Vempati Srinivasa Rao 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
28 Jun 2021 SERC Institute for Infocomm Research Transfer Learning-Based Artificial Intelligence-Integrated Physical Modeling to Enable Failure Analysis for 3 Nanometer and Smaller Silicon-Based CMOS Transistors Jieming Pan, Kain Lu Low, Joydeep Ghosh, Senthilnath Jayavelu, Md Meftahul Ferdaus, Shang Yi Lim, Evgeny Zamburg, Yida Li, Baoshan Tang, Xinghua Wang, Jin Feng Leong, Savitha Ramasamy, Tonio Buonassisi, Chen-Khong Tham, Aaron Voon-Yew Thean ACS Applied Nano Materials