| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 18 Jan 2023 | SERC | Institute for Infocomm Research | Improved Bump Detection and Defect Identification for HBMs using Refined Machine Learning Approach | Wang Jie, Richard Chang, Xu Xun, Cai Lile, Chuang Sheng Foo, Ramanpreet Singh Pahwa | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) |