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Publication date Communities Collections Article title Author(s) Journal/Conference
12 Jul 2022 SERC Institute for Infocomm Research Automated Detection and Segmentation of HBMs in 3D X-ray Images using Semi-Supervised Deep Learning Ramanpreet Singh Pahwa, Richard Chang, Wang Jie, Xu Xun, Oo Zaw Min, Foo Chuan Sheng, Chong Ser Choong, Vempati Srinivasa Rao 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
27 Apr 2022 SERC Institute for Infocomm Research On the Use of Component Structural Characteristics for Voxel Segmentation in Semicon 3D Images Tin Lay Nwe, Ramanpreet Singh Pahwa, Richard Chang, Oo Zaw Min, Wang Jie, Yiqun Li, Dongyun Lin, Shitala Prasad, Sheng Dong ICASSP 2022 - 2022 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP)
2 Nov 2021 SERC Institute for Infocomm Research A Survey on Object Detection Performance with Different Data Distributions Ramanpreet Singh Pahwa, Richard Chang, Wang Jie, Sankeerthana Satini, Chandrashekar Viswanathan, Du Yiming, Vernica Jain, Chen Tai Pang, Wan Kong Wah Lecture Notes in Computer Science
10 Aug 2021 SERC Institute for Infocomm Research, Institute of Microelectronics Automated Attribute Measurements of Buried Package Features in 3D X-ray Images using Deep Learning Ramanpreet Singh Pahwa, Ma Tin Lay Nwe, Richard Chang, Oo Zaw Min, Wang Jie, Saisubramaniam Gopalakrishnan, David Ho Soon Wee, Ren Qin, Vempati Srinivasa Rao, Haiwen Dai, Jens Timo Neumann, Ramani Pichumani, Tom Gregorich 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
1 Dec 2020 SERC Institute for Infocomm Research MACHINE-LEARNING BASED METHODOLOGIES FOR 3D X-RAY MEASUREMENT, CHARACTERIZATION AND OPTIMIZATION FOR BURIED STRUCTURES IN ADVANCED IC PACKAGES Ramanpreet Singh Pahwa, Tin Lay Nwe, Richard Chang, Zaw Min, Wang Jie, Tom Gregorich, David Ho, Vempati Srinivasa Rao International Wafer Level Packaging Conference (IWLPC)