| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 3 Aug 2023 | SERC | Institute for Infocomm Research | 3D Defect Detection and Metrology of HBMs using Semi-Supervised Deep Learning | Ramanpreet Singh Pahwa, Richard Chang, Wang Jie, Zhao Ziyuan, Cai Lile, Xu Xun, Foo Chuan Sheng, Chong Ser Choong, Vempati Srinivasa Rao | 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |
| 18 Jan 2023 | SERC | Institute for Infocomm Research | Improved Bump Detection and Defect Identification for HBMs using Refined Machine Learning Approach | Wang Jie, Richard Chang, Xu Xun, Cai Lile, Chuang Sheng Foo, Ramanpreet Singh Pahwa | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) |