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Publication date Communities Collections Article title Author(s) Journal/Conference
3 Aug 2023 SERC Institute for Infocomm Research 3D Defect Detection and Metrology of HBMs using Semi-Supervised Deep Learning (Pending publish) Ramanpreet Singh Pahwa, Richard Chang, Wang Jie, Zhao Ziyuan, Cai Lile, Xu Xun, Foo Chuan Sheng, Chong Ser Choong, Vempati Srinivasa Rao 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
18 Jan 2023 SERC Institute for Infocomm Research Improved Bump Detection and Defect Identification for HBMs using Refined Machine Learning Approach Wang Jie, Richard Chang, Xu Xun, Cai Lile, Chuang Sheng Foo, Ramanpreet Singh Pahwa 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)