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Publication date Communities Collections Article title Author(s) Journal/Conference
5 Mar 2026 SERC Institute of Microelectronics Flip chip interconnects for quantum computing application: a comparison between tin-silver and indium bump Norhanani Binte Jaafar, Daniel Lau, Hongyu Li, Yong Chyn Ng, Ya-Ching Tseng Quantum Computing, Communication, and Simulation VI
24 Feb 2026 SERC Institute of Microelectronics 2.5D Cryogenic Packaging for Advanced Quantum Processors Norhanani Binte Jaafar, Li Hongyu, Ya-Ching Tseng, Yong Chyn Ng, Daniel Lau 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
26 Jun 2025 SERC Institute of Microelectronics Addressing Key Process Challenges in Developing High Aspect Ratio TSVs up to 15 with 1 μm Critical Dimension (Pending publish) Tran Van Nhat Anh, Nandini Venkataraman, Ya-Ching Tseng, Arvind Sundaram, Binni Varghese, Heng Zeng Wei, B.S.S. Chandra Rao 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
26 Jun 2024 SERC Institute of Microelectronics Electrical Characterization and Reliability Studies of Nano-TSV Ya-Ching Tseng, King-Jien Chui, Simon Chun Kiat Goh, Daniel Lau, Hongyu Li, Tran Van Nhat Anh, Haitao Yu, Chin Khang Tew, Gim Guan Chen, Binni Varghese, Calvin Chua Hung Ming 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics A Precise Wafer Thinning Integration Process for nano-TSV Formation Ya-Ching Tseng, Simon Chun Kiat Goh, Senthilkumar Darshini, Nandini Venkataraman, Arvind Sundaram, Tew Chin Khang, Yoo Jae Ok, King-Jien Chui 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics Demonstration of a CMOS-Compatible Superconducting Cryogenic Interposer for Advanced Quantum Processors King-Jien Chui, Hongyu Li, Yong Chyn Ng, Chit Siong Lau, K. E. J. Goh, D. Huang, Ya-Ching Tseng, J. K. Chen, H. Yu, B. N. Jaafar, H. Lin, B. Varghese 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)