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Publication date Communities Collections Article title Author(s) Journal/Conference
26 Jun 2025 SERC Institute of Microelectronics Novel Selective Metal Capping on Cu pad Enabling Void-Free Hybrid Bonding at Low Thermal Budgets, Irrespective of Cu Topography and Microstructure Hemanth Kumar Cheemalamarri, Masahisa Fujino, Chandra Rao Bhesetti, Lau Boon Long, Mishra Dileep, Srinivasa Rao Vempati, Navab Singh 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
26 Jun 2024 SERC Institute of Microelectronics Process Challenges in Thin Wafers Fabrication with Double Side Hybrid Bond Pads for Chip Stacking Mishra Dileep Kumar, Vasarla Nagendra Sekhar, B.S.S. Chandra Rao, Ser Choong Chong, Vempati Srinivasa Rao 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
18 Mar 2024 SERC Institute of Microelectronics Process Development and Integration on Si Substrate for Ion trap-based Quantum Processors H. Y. Li, Clarence Liu Huihong, Norhanani Jaafar, Morteza Ahmadi, Mishra Dileep Kumar, Goh Chun Kiat Simonl, Zhou YanYan, Manas Mukherjee, Chui King Jien 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Reliability Assessment of 2.5D Module using Chip to Wafer Hybrid Bonding Ser Choong Chong, Jason Au Keng Yuen, Vasarla Nagendra Sekhar, Ismael Cereno Daniel, Mishra Dileep Kumar, Vempati Srinivasa Rao 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics Cu Damascene Process on Temporary Bonded Wafers for Thin Chip Stacking using Cu-Cu Hybrid Bonding Vasarla Nagendra Sekhar, Mishra Dileep Kumar, Prayudi Lianto, Ser Choong Chong, Vempati Srinivasa Rao 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)