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Publication date Communities Collections Article title Author(s) Journal/Conference
26 Jun 2025 SERC Institute of Microelectronics Process Development, Challenges, and Strategies for Void-Free Multi-Chip Stacking in Hybrid Bonding Applications (Pending publish) Ser Choong Chong, Ling Xie, Vasarla Nagendra Sekhar, Mishra Dileep Kumar, B.S.S. Chandra Rao, Vempati Srinivasa Rao 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
26 Jun 2025 SERC Institute of Microelectronics Thermal Characterization of HBMs Integrated via Hybrid Bonding Huicheng Feng, Yong Han, Gongyue Tang, Ling Xie, Vasarla Nagendra Sekhar 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
20 Jul 2018 BMRC Institute of Molecular and Cell Biology, Genome Institute of Singapore VHL substrate transcription factor ZHX2 as an oncogenic driver in clear cell renal cell carcinoma Jing Zhang, Tao Wu, Jeremy Simon, Mamoru Takada, Ryoichi Saito, Cheng Fan, Xian-De Liu, Eric Jonasch, Ling Xie, Xian Chen, Xiaosai Yao, Bin Tean Teh, Patrick Tan, Xingnan Zheng, Mingjie Li, Cortney Lawrence, Jie Fan, Jiang Geng, Xijuan Liu, Lianxin Hu, Jun Wang, Chengheng Liao, Kai Hong, Giada Zurlo, Joel S. Parker, J. Todd Auman, Charles M. Perou, W. Kimryn Rathmell, William Y. Kim, Marc W. Kirschner, William G. Kaelin, Albert S. Baldwin, Qing Zhang Science
30 May 2017 SERC Institute of Microelectronics Study of C2W Bonding Using Cu Pillar with Side-wall Plated Solder Daniel Ismael Cereno, Sunil Wickramanayaka, Vasarla Nagendra Sekhar, Ling Xie 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)