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Publication date Communities Collections Article title Author(s) Journal/Conference
17 Jun 2026 SERC Institute of Microelectronics High-Density, Energy-Efficient CPO Platform with PIC-in-Mold Interposer Architecture for AI/ML Data Centers (Pending publish) Sajay Bhuvanendran Nair Gourikutty, Wu Jiaqi, Zhonghua Yang, Mihai Rotaru, Ji Lin, Han Yong, Chia Lai Yee, Sharon Lim, San Sandra, Chai Tai Chong, Surya Bhattacharya 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
18 Mar 2024 SERC Institute of Microelectronics Characterization of Differential TMV Vertical Interconnects to 50GHz with Double Side Measurement Wu Jiaqi, Lim Teck Guan, Jason Tsung-Yang Liow, Sajay Bhuvanendran Nair Gourikutty 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Parasitic Surface Conduction Effect of TSV on Interconnection Performance in RF SOI for 2.5D Integration Zhou Lin, Lim Teck Guan, Wu Jiaqi, Xu Feng, Jong Ming Chinq, Ng Yong Chyn 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics RF Performance Study of Through-Mold-Via (TMV) using L-2L De-Embedding Method Wu Jiaqi, Li Kangrong, Lim Teck Guan 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)