RF Performance Study of Through-Mold-Via (TMV) using L-2L De-Embedding Method

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RF Performance Study of Through-Mold-Via (TMV) using L-2L De-Embedding Method
Title:
RF Performance Study of Through-Mold-Via (TMV) using L-2L De-Embedding Method
Journal Title:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
Keywords:
Publication Date:
05 January 2022
Citation:
Jiaqi, W., Kangrong, L., & Guan, L. T. (2021). RF Performance Study of Through-Mold-Via (TMV) using L-2L De-Embedding Method. 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc53413.2021.9664001
Abstract:
In advanced packaging, vertical interconnects enable the frontside to backside connections. This work presents a method to extract the RF characteristics of Through-Mold Via (TMV) using L-2L de-embedding method. Detailed equations and de-embedding procedures are demonstrated in this paper. Simulations and measurements of 3 TMV structures with different pitch are presented to validate the method up to 50GHz.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the A*STAR - IPP - More-than-Moore (MtM) Design-for-Test (DFT) Centre-of-Excellence (COE)
Grant Reference no. : 1525700050
Description:
© 2022 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
ISBN:
978-1-6654-1619-1
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