Jiaqi, W., Kangrong, L., & Guan, L. T. (2021). RF Performance Study of Through-Mold-Via (TMV) using L-2L De-Embedding Method. 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc53413.2021.9664001
Abstract:
In advanced packaging, vertical interconnects enable the frontside to backside connections. This work presents a method to extract the RF characteristics of Through-Mold Via (TMV) using L-2L de-embedding method. Detailed equations and de-embedding procedures are demonstrated in this paper. Simulations and measurements of 3 TMV structures with different pitch are presented to validate the method up to 50GHz.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the A*STAR - IPP - More-than-Moore (MtM) Design-for-Test (DFT) Centre-of-Excellence (COE)
Grant Reference no. : 1525700050