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Publication date Communities Collections Article title Author(s) Journal/Conference
5 Jan 2022 SERC Institute of Microelectronics RF Performance Study of Through-Mold-Via (TMV) using L-2L De-Embedding Method Wu Jiaqi, Li Kangrong, Lim Teck Guan 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Testing Multiple High-Speed Channels using Automated Test Equipment (ATE), SOC 93K, in parallel Ratan Bhimrao Umralkar, Li Kangrong 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Systematic Signal Integrity Analysis on Fine Pitch Probe Card for HBM Interposer Testing Li Kangrong, Ratan Bhimrao Umralkar 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021 SERC Institute of Microelectronics Electrical design challenges in High Bandwidth Memory and Advanced Interface Bus interfaces on HD-FOWLP technology Mihai Dragos Rotaru, Li Kangrong 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)