Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
---|---|---|---|---|---|
18 Mar 2024 | SERC | Institute of Microelectronics | Indium-based Flip-chip Interconnect for Cryogenic Packaging | Norhanani Binte Jaafar, Li Hongyu, Chong Ser Choong, Ng Yong Chyn, Ding Huang, Chit Siong Lau, Kuan Eng Johnson Goh, King-Jien Chui | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
18 Mar 2024 | SERC | Institute of Microelectronics | Identify critical packaging parameters impacting wafer warpage using FEA and statistical analysis techniques | Ji Lin, Ng Yong Chyn | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
18 Mar 2024 | SERC | Institute of Microelectronics | Parasitic Surface Conduction Effect of TSV on Interconnection Performance in RF SOI for 2.5D Integration | Zhou Lin, Lim Teck Guan, Wu Jiaqi, Xu Feng, Jong Ming Chinq, Ng Yong Chyn | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |