Characterization of Differential TMV Vertical Interconnects to 50GHz with Double Side Measurement

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Characterization of Differential TMV Vertical Interconnects to 50GHz with Double Side Measurement
Title:
Characterization of Differential TMV Vertical Interconnects to 50GHz with Double Side Measurement
Journal Title:
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
Keywords:
Publication Date:
18 March 2024
Citation:
Jiaqi, W., Guan, L. T., Tsung-Yang Liow, J., & Nair Gourikutty, S. B. (2023, December 5). Characterization of Differential TMV Vertical Interconnects to 50GHz with Double Side Measurement. 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc59621.2023.10457916
Abstract:
Fan-Out Wafer Level Packaging (FOWLP) can be a good candidate for heterogeneous integration of Photonic ICs (PIC) and Electronic ICs (EIC) in the same package to achieve low interconnect loss, low power consumption, and small factor for optical communications requiring high data transmission. The vertical interconnects Through Mold Via (TMV) in FOWLP can be utilized for the RF routing from frontside to backside vertically. The conventional way of characterizing the RF performance of vertical interconnects is to de-embed the vertical section by measuring a back-to-back structure with multiple de-embedding structures. In this paper, differential TMV structures in GSSG configuration are characterized by direct measurement using double-side probing techniques from DC to 50GHz. Three GSSG TMV interconnects with different TMV pitches are measured and compared. The 100Gbps PAM4 eye diagrams of the interconnects are also shown.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the A*STAR - Industry Alignment Fund - Industry Collaboration Projects
Grant Reference no. : I2001E0071
Description:
© 2024 IEEE.  Personal use of this material is permitted.  Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
ISSN:
979-8-3503-2957-5
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