Jiaqi, W., Guan, L. T., Tsung-Yang Liow, J., & Nair Gourikutty, S. B. (2023, December 5). Characterization of Differential TMV Vertical Interconnects to 50GHz with Double Side Measurement. 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc59621.2023.10457916
Abstract:
Fan-Out Wafer Level Packaging (FOWLP) can be a good
candidate for heterogeneous integration of Photonic ICs (PIC) and Electronic ICs (EIC) in the same
package to achieve low interconnect loss, low power consumption, and small factor for optical
communications requiring high data transmission. The vertical interconnects Through Mold Via (TMV)
in FOWLP can be utilized for the RF routing from frontside to backside vertically. The conventional
way of characterizing the RF performance of vertical interconnects is to de-embed the vertical
section by measuring a back-to-back structure with multiple de-embedding structures. In this paper,
differential TMV structures in GSSG configuration are characterized by direct measurement using
double-side probing techniques from DC to 50GHz. Three GSSG TMV interconnects with different TMV
pitches are measured and compared. The 100Gbps PAM4
eye diagrams of the interconnects are also shown.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the A*STAR - Industry Alignment Fund - Industry Collaboration Projects
Grant Reference no. : I2001E0071