| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 18 Mar 2024 | SERC | Institute of Microelectronics | Parasitic Surface Conduction Effect of TSV on Interconnection Performance in RF SOI for 2.5D Integration | Zhou Lin, Lim Teck Guan, Wu Jiaqi, Xu Feng, Jong Ming Chinq, Ng Yong Chyn | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
| 18 Mar 2024 | SERC | Institute of Microelectronics | Characterization of FOWLP Antenna in Packages | Sun Mei, Lim Teck Guan, Zhou Lin | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |