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Publication date Communities Collections Article title Author(s) Journal/Conference
5 Mar 2026 SERC Institute of Microelectronics Flip chip interconnects for quantum computing application: a comparison between tin-silver and indium bump Norhanani Binte Jaafar, Daniel Lau, Hongyu Li, Yong Chyn Ng, Ya-Ching Tseng Quantum Computing, Communication, and Simulation VI
24 Feb 2026 SERC Institute of Microelectronics 2.5D Cryogenic Packaging for Advanced Quantum Processors Norhanani Binte Jaafar, Li Hongyu, Ya-Ching Tseng, Yong Chyn Ng, Daniel Lau 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Indium-based Flip-chip Interconnect for Cryogenic Packaging Norhanani Binte Jaafar, Li Hongyu, Chong Ser Choong, Ng Yong Chyn, Ding Huang, Chit Siong Lau, Kuan Eng Johnson Goh, King-Jien Chui 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Comprehensive Study on Thermal Aging and Ball Shear Characterization of SAC-X Solders Norhanani Binte Jaafar, Chong Ser Choong, Sharon Lim Pei Siang, Chai Tai Chong 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)