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Publication date Communities Collections Article title Author(s) Journal/Conference
17 Jun 2024 SERC Institute of Materials Research & Engineering CMOS-compatible photonic integrated circuits on thin-film ScAlN Sihao Wang, Veerendra Dhyani, Sakthi Sanjeev Mohanraj, Xiaodong Shi, Binni Varghese, Wing Wai Chung, Ding Huang, Zhi Shiuh Lim, Qibin Zeng, Huajun Liu, Xianshu Luo, Victor Leong, Nanxi Li, Di Zhu APL Photonics
6 Jun 2024 SERC Institute of Materials Research & Engineering Nanoironing van der Waals Heterostructures toward Electrically Controlled Quantum Dots Teymour Talha-Dean, Yaoju Tarn, Subhrajit Mukherjee, John Wellington John, Ding Huang, Ivan A. Verzhbitskiy, Dasari Venkatakrishnarao, Sarthak Das, Rainer Lee, Abhishek Mishra, Shuhua Wang, Yee Sin Ang, Kuan Eng Johnson Goh, Chit Siong Lau ACS Applied Materials & Interfaces
19 Apr 2024 SERC Institute of Materials Research and Engineering Hybrid Quantum Systems with Artificial Atoms in Solid State Cleaven Chia, Ding Huang, Victor Leong, Jian Feng Kong, Kuan Eng Johnson Goh Advanced Quantum Technologies
18 Mar 2024 SERC Institute of Microelectronics Investigation of SnAg Superconductivity as Solder Material for Cryogenic Packaging (Pending publish) Yong Chyn Ng, Hongyu Li, Norhanani Binte Jaafar, Rainer Cheow Siong Lee, Ding Huang, Chit Siong Lau, Kuan Eng Johnson Goh, King-Jien Chui 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Room Temperature Plasma-Enhanced Niobium-Niobium Wafer Bonding for 3D Integration of Superconducting Interconnects for Quantum Processing (Pending publish) Simon Chun Kiat Goh, Cheemalamarri Hemanth Kumar, Liangxing Hu, Woon Shervonne, Norhanani Jaafar, Yap Lee Khoon Sherry, Ding Huang, Chit Siong Lau, Senthil Kumar Karuppannan, Hongyu Li, Chuan Seng Tan, King-Jien Chui 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Indium-based Flip-chip Interconnect for Cryogenic Packaging (Pending publish) Norhanani Binte Jaafar, Li Hongyu, Chong Ser Choong, Ng Yong Chyn, Ding Huang, Chit Siong Lau, Kuan Eng Johnson Goh, King-Jien Chui 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
31 May 2023 SERC Institute of Materials Research and Engineering Dielectrics for Two-Dimensional Transition-Metal Dichalcogenide Applications Chit Siong Lau, Sarthak Das, Ivan A. Verzhbitskiy, Ding Huang, Yiyu Zhang, Teymour Talha-Dean, Wei Fu, Dasari Venkatakrishnarao, Kuan Eng Johnson Goh ACS Nano
6 Apr 2023 SERC Institute of Materials Research and Engineering Liquid-Metal-Printed Ultrathin Oxides for Atomically Smooth 2D Material Heterostructures Yiyu Zhang, Dasari Venkatakrishnarao, Michel Bosman, Wei Fu, Sarthak Das, Fabio Bussolotti, Rainer Lee, Siew Lang Teo, Ding Huang, Ivan Verzhbitskiy, Zhuojun Jiang, Zhuoling Jiang, Jianwei Chai, Shi Wun Tong, Zi-En Ooi, Calvin Pei Yu Wong, Yee Sin Ang, Kuan Eng Johnson Goh, Chit Siong Lau ACS Nano