Jaafar, N. B., Hongyu, L., Choong, C. S., Yong Chyn, N., Huang, D., Lau, C. S., Goh, K. E. J., & Chui, K.-J. (2023, December 5). Indium-based Flip-chip Interconnect for Cryogenic Packaging. 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc59621.2023.10457739
Abstract:
Flip-chip die attachment manufacturing has seen a dramatic increase in recent years due to improvements in electrical performance and reduced form-factor. There have been increasing efforts recently in chip-packaging for qubit devices operating at cryogenic temperatures. Flip-chip assembly process can help to reduce existing cumbersome wirings, latency and enable heterogeneous integration [1],[2],[3].Alloys containing indium have frequently been used in processes that need low-temperature operation. Indium has the benefits of being ductile, cryogenically stable, and having strong thermal and electrical conductivity as a solder material. Indium-based solder is preferred due to its superconductivity, soft and malleable characteristic for reliability. In this manuscript, we demonstrate a flip chip process using 99.9Indium (99.9In) solder ball with a diameter size of 100µm
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Funding Info:
This research / project is supported by the A*STAR - Cryo-electronics Toolbox: Interposer, MUX & HEMT for Solid-State Qubits Engineering (Delta Q) (Project #7)
Grant Reference no. : C210917001
This research / project is supported by the A*STAR - Centre of Excellence in Advanced Packaging 3.0
Grant Reference no. : I2101E0008