Search results

Publication date Communities Collections Article title Author(s) Journal/Conference
17 Jun 2026 SERC Institute of Microelectronics Process Optimization for Chip-to-Wafer Hybrid Bonding Using Inter-Die Gap Fill Integration Approach (Pending publish) Mishra Dileep Kumar, Vasarla Nagendra Sekhar, Sasi Kumar Tippabhotla, Hipona Randy Tupaen, Norhanani Jaafar, B.S.S. Chandra Rao, Daniel Ismael, Xie Ling, Ser Choong Chong, Vempati Srinivasa Rao 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
30 May 2017 SERC Institute of Microelectronics Study of C2W Bonding Using Cu Pillar with Side-wall Plated Solder Daniel Ismael Cereno, Sunil Wickramanayaka, Vasarla Nagendra Sekhar, Ling Xie 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
30 May 2017 SERC Institute of Microelectronics Process and Reliability of Large Fan-Out Wafer Level Package based Package-on-Package Sharon PS Lim, Daniel Ismael, Ye Yong Liang, Vempati Srinivasa Rao, Chai Tai Chong, David Ho, Ding Mian Zhi, Chong Ser Choong 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
30 May 2017 SERC Institute of Microelectronics Stealth Dicing Challenges for MEMS Wafer Applications Daniel Ismael Cereno, Sunil Wickramanayaka 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)