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Publication date Communities Collections Article title Author(s) Journal/Conference
24 Feb 2026 SERC Institute of Microelectronics Chip Stacking: Impact of Chip Spacing in C2W Hybrid Bonding on Temporary Bonding and Debonding (Pending publish) Jaibir Sharma, Dileep Kumar Mishra, Vasarla Nagendra Sekhar, Bhesetti Chandra Rao 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
26 Jun 2024 SERC Institute of Microelectronics Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bonding Hemanth Kumar Cheemalamarri, Arvind Sundaram, San Sandra, Tran Van Nhat Anh, Bhesetti Chandra Rao, Chen Gim Guan, Yu Haitao, Mani Raju, Luo Ping, Lee Chaeeun, Vempati Srinivasa Rao, Navab Singh 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics Alignment through thick Si layer for high resolution patterning on bonded wafers with tight overlay margin using immersion lithography Arvind Sundaram, Chin Khang Tew, Guo Wei Tan, Yuan-Hsing Fu, Hongyu Li, Nandini Venkataraman, Bhesetti Chandra Rao, Navab Singh 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)