| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 26 Jun 2024 | SERC | Institute of Microelectronics | Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bonding | Hemanth Kumar Cheemalamarri, Arvind Sundaram, San Sandra, Tran Van Nhat Anh, Bhesetti Chandra Rao, Chen Gim Guan, Yu Haitao, Mani Raju, Luo Ping, Lee Chaeeun, Vempati Srinivasa Rao, Navab Singh | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| 18 Mar 2024 | SERC | Institute of Microelectronics | Process and Integration Challenges for Via Last TSV (from top) on Functional LNA SOI wafers for 3D Heterogeneous chiplet integration | Xiangyu Wang, Mihai Dragos Rotaru, Yu Haitao, Mingchinq Jonq, Chai Tai Chong, King-Jien Chui | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |