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Publication date Communities Collections Article title Author(s) Journal/Conference
18 Mar 2024 SERC Institute of Microelectronics Process and Integration Challenges for Via Last TSV (from top) on Functional LNA SOI wafers for 3D Heterogeneous chiplet integration Xiangyu Wang, Mihai Dragos Rotaru, Yu Haitao, Mingchinq Jonq, Chai Tai Chong, King-Jien Chui 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics Design and Analysis of 3D Heterogeneous Chiplet Stack for RF Front-End Module Minituarization Mihai Dragos Rotaru, Shashank Tiwari, Paul Castillou, Chai Tai Chong, Chui King Jien 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
5 Jan 2022 SERC Institute of Microelectronics Chiplet-based Architecture Design for Multi-Core Neuromorphic Processor Jingjing Lan, Vishnu P. Nambiar, Rheeshaalaen Sabapathy, Mihai Dragos Rotaru, Anh Tuan Do 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021 SERC Institute of Microelectronics Electrical design challenges in High Bandwidth Memory and Advanced Interface Bus interfaces on HD-FOWLP technology Mihai Dragos Rotaru, Li Kangrong 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)