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Publication date Communities Collections Article title Author(s) Journal/Conference
18 Jun 2026 SERC Institute for Infocomm Research FAPlace: Joint Optimization of Chiplet Placement and Interposer Footprint for 2.5D Systems (Pending publish) Yubo Hou, Sezin Kircali Ata, Gen Liang Lim, Richard Chang, Mihai Dragos Rotaru, Rahul Dutta, Ashish James Proceedings of the Great Lakes Symposium on VLSI 2026
24 Feb 2026 SERC Institute for Infocomm Research TDPNavigator-Placer: Thermal- and Wirelength-Aware Chiplet Placement in 2.5D Systems Through Multi-Agent Reinforcement Learning (Pending publish) Yubo Hou, Furen Zhuang, Partha Pratim Kundu, Sezin Ata Kircali, Jie Wang, Mihai Dragos Rotaru, Dutta Rahul, Ashish James 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
18 Sep 2025 SERC Institute for Infocomm Research The Initialization Effect: Refining Bayesian Optimization for Circuit Design Anusha James, Zhi Hui Kong, Sezin Kircali Ata, Khin Mi Mi Aung, Kiat Seng Yeo, Chuan Sheng Foo, Ashish James IEEE Transactions on Circuits and Systems for Artificial Intelligence
21 Apr 2025 SERC Institute for Infocomm Research Bayesian Optimization for Chiplet Placement on 2.5D System in Package Platforms: Tackling Rotation and Constraint Challenges Furen Zhuang, Partha Kundu, Sezin Ata, Yubo Hou, Mihai Rotaru, Rahul Dutta, Ashish James AI4X
3 Mar 2025 SERC Institute for Infocomm Research AI-Powered Revolution Zhi Hui Kong, Anusha James, Sezin Kircali Ata, Khin Mi Mi Aung, Chuan Sheng Foo, Ashish James, Kiat Seng Yeo IEEE Nanotechnology Magazine
27 Dec 2024 SERC Institute for Infocomm Research Towards Safe and Efficient Analog Circuit Design: Active Learning for Feasibility Region Exploration Sezin Kircali Ata, Zhi Hui Kong, Anusha James, Lile Cai, Kiat Seng Yeo, Khin Mi Mi Aung, Chuan Sheng Foo, Ashish James 2024 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)
6 Dec 2024 SERC Institute for Infocomm Research Accelerating Bonding Overlay Error Optimization in Fine-Pitch Wafer-to-Wafer Hybrid Bonding through Machine Learning Ashish James, Nandini Venkataraman, Ji Hong Miao, Navab Singh, Xiaoli Li 26th IEEE Electronics Packaging Technology Conference (EPTC)
3 Dec 2024 SERC Institute for Infocomm Research Efficient Thermal-Aware Floor-planning with Bayesian Optimization: A Simulation-Efficient Approach Furen Zhuang, Partha Kundu, Sezin Kircali, Yubo Hou, Mihai Rotaru, Rahul Dutta, Ashish James 26th Electronics Packaging Technology Conference (EPTC 2024)
30 Jul 2024 SERC Institute for Infocomm Research Is Complexity Required for Neural Network Pruning? A Case Study on Global Magnitude Pruning Manas Gupta, Efe Camci, Vishandi Rudy Keneta, Abhishek Vaidyanathan, Ritwik Kanodia, Ashish James, Chuan-Sheng Foo, Min Wu, Jie Lin 2024 IEEE Conference on Artificial Intelligence (CAI)
2 Jul 2024 SERC Institute for Infocomm Research The Initialization Factor: Understanding its Impact on Active Learning for Analog Circuit Design Sezin Kircali Ata, Zhi Hui Kong, Anusha James, Lile Cai, Kiat Seng Yeo, Khin Mi Mi Aung, Chuan Sheng Foo, Ashish James 2024 IEEE International Symposium on Circuits and Systems (ISCAS)