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11 Nov 2022
SERC
Institute for Infocomm Research
Bayesian Deep Active Learning for Analog Circuit Performance Classification
Lining Zhang,
Salahuddin Raju,
Ashish James,
Rahul Dutta,
Gregoire Fournier,
Damien Lancry,
Kevin Chai Tshun Chuan,
Vijay Ramaseshan Chandrasekhar,
Chuan Sheng Foo
2022 IEEE International Symposium on Circuits and Systems (ISCAS)
10 Oct 2022
SERC
Institute for Infocomm Research
Automated Deep Learning Platform for Accelerated Analog Circuit Design
Rahul Dutta,
Ashish James,
Salahuddin Raju,
Yong-Joon Jeon,
Chuan Sheng Foo,
Kevin Tshun Chuan Chai
2022 IEEE 35th International System-on-Chip Conference (SOCC)
20 Jul 2021
SERC
Institute of Microelectronics
Prognostics and Health Management of Wafer Chemical-Mechanical Polishing System using Autoencoder
Kart-Leong Lim,
Rahul Dutta
2021 IEEE International Conference on Prognostics and Health Management (ICPHM)
3 Sep 2019
SERC
Institute for Infocomm Research
Learning of Multi-Dimensional Analog Circuits Through Generative Adversarial Network (GAN)
Raju Salahuddin,
Rahul Dutta,
Ashish James,
Chemmanda John Leo,
Yong-Joon Jeon,
Balagopal Unnikrishnan,
Foo Chuan Sheng,
Zeng Zeng,
Kevin Tshun Chuan Chai,
Vijay Ramaseshan Chandrasekhar
2019 32nd IEEE International System-on-Chip Conference (SOCC)
2 Jun 2019
SERC
Institute for Infocomm Research
Semi Supervised Learning of Multi-Dimensional Analog Circuits
Rahul Dutta,
Salahuddin Raju,
Ashish James,
Bruno Lecouat,
Chemmanda John Leo,
Yong-Joon Jeon,
Balagopal Unnikrishnan,
Chuan Sheng Foo,
Zeng Zeng,
Kevin Tshun Chuan Chai,
Vijay R. Chandrasekhar
Design Automation Conference (DAC) (2019)
15 Feb 2016
SERC
Institute of Microelectronics
An Analytical Capacitance Model for Through Silicon Vias (TSVs) in Floating Silicon Substrate
Ka Fai Chang,
Jun Zhou,
Surya Bhattacharya,
Roshan Weerasekera,
Guruprasad Katti,
Rahul Dutta,
Songbai Zhang
IEEE TRANSACTION ON ELECTRON DEVICES
1 Aug 2015
SERC
Institute of Microelectronics
Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC–TSI)
Guruprasad Katti,
David Soon Wee Ho,
Hong Yu Li,
Rahul Dutta,
Roshan Weerasekera,
Ka Fai Chang,
Jong-Kai Lin,
Vempati Srinivasa Rao,
Surya Bhattacharya
IEEE Design & Test
23 Jun 2015
SERC
Institute of Microelectronics
Heterogeneous 2.5D integration on through silicon interposer
Xiaowu Zhang,
Jong Kai Lin,
Sunil Wickramanayaka,
Songbai Zhang,
Roshan Weerasekera,
Rahul Dutta,
Ka Fai Chang,
King-Jien Chui,
Hong Yu Li,
David Ho,
Liang Ding,
Guruprasad Katti,
Suryanarayana Bhattacharya,
Dim-Lee Kwong
Applied Physics Reviews
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