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Publication date Communities Collections Article title Author(s) Journal/Conference
11 Nov 2022 SERC Institute for Infocomm Research Bayesian Deep Active Learning for Analog Circuit Performance Classification Lining Zhang, Salahuddin Raju, Ashish James, Rahul Dutta, Gregoire Fournier, Damien Lancry, Kevin Chai Tshun Chuan, Vijay Ramaseshan Chandrasekhar, Chuan Sheng Foo 2022 IEEE International Symposium on Circuits and Systems (ISCAS)
10 Oct 2022 SERC Institute for Infocomm Research Automated Deep Learning Platform for Accelerated Analog Circuit Design Rahul Dutta, Ashish James, Salahuddin Raju, Yong-Joon Jeon, Chuan Sheng Foo, Kevin Tshun Chuan Chai 2022 IEEE 35th International System-on-Chip Conference (SOCC)
20 Jul 2021 SERC Institute of Microelectronics Prognostics and Health Management of Wafer Chemical-Mechanical Polishing System using Autoencoder Kart-Leong Lim, Rahul Dutta 2021 IEEE International Conference on Prognostics and Health Management (ICPHM)
3 Sep 2019 SERC Institute for Infocomm Research Learning of Multi-Dimensional Analog Circuits Through Generative Adversarial Network (GAN) Raju Salahuddin, Rahul Dutta, Ashish James, Chemmanda John Leo, Yong-Joon Jeon, Balagopal Unnikrishnan, Foo Chuan Sheng, Zeng Zeng, Kevin Tshun Chuan Chai, Vijay Ramaseshan Chandrasekhar 2019 32nd IEEE International System-on-Chip Conference (SOCC)
2 Jun 2019 SERC Institute for Infocomm Research Semi Supervised Learning of Multi-Dimensional Analog Circuits Rahul Dutta, Salahuddin Raju, Ashish James, Bruno Lecouat, Chemmanda John Leo, Yong-Joon Jeon, Balagopal Unnikrishnan, Chuan Sheng Foo, Zeng Zeng, Kevin Tshun Chuan Chai, Vijay R. Chandrasekhar Design Automation Conference (DAC) (2019)
15 Feb 2016 SERC Institute of Microelectronics An Analytical Capacitance Model for Through Silicon Vias (TSVs) in Floating Silicon Substrate Ka Fai Chang, Jun Zhou, Surya Bhattacharya, Roshan Weerasekera, Guruprasad Katti, Rahul Dutta, Songbai Zhang IEEE TRANSACTION ON ELECTRON DEVICES
1 Aug 2015 SERC Institute of Microelectronics Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC–TSI) Guruprasad Katti, David Soon Wee Ho, Hong Yu Li, Rahul Dutta, Roshan Weerasekera, Ka Fai Chang, Jong-Kai Lin, Vempati Srinivasa Rao, Surya Bhattacharya IEEE Design & Test
23 Jun 2015 SERC Institute of Microelectronics Heterogeneous 2.5D integration on through silicon interposer Xiaowu Zhang, Jong Kai Lin, Sunil Wickramanayaka, Songbai Zhang, Roshan Weerasekera, Rahul Dutta, Ka Fai Chang, King-Jien Chui, Hong Yu Li, David Ho, Liang Ding, Guruprasad Katti, Suryanarayana Bhattacharya, Dim-Lee Kwong Applied Physics Reviews