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Publication date Communities Collections Article title Author(s) Journal/Conference
24 Feb 2026 SERC Institute for Infocomm Research AI-Powered Super-Resolution for Scalable and Efficient 3D X-Ray Inspection of 3D-Stacked HBMs Yang Yu, Kangkang Lu, Jie Wang, Richard Chang, Meng Keong Lim, Ser Choong Chong, Ramanpreet Singh Pahwa, Xulei Yang 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
18 Jan 2023 SERC Institute for Infocomm Research Improved Bump Detection and Defect Identification for HBMs using Refined Machine Learning Approach Wang Jie, Richard Chang, Xu Xun, Cai Lile, Chuang Sheng Foo, Ramanpreet Singh Pahwa 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
12 Jul 2022 SERC Institute for Infocomm Research Automated Detection and Segmentation of HBMs in 3D X-ray Images using Semi-Supervised Deep Learning Ramanpreet Singh Pahwa, Richard Chang, Wang Jie, Xu Xun, Oo Zaw Min, Foo Chuan Sheng, Chong Ser Choong, Vempati Srinivasa Rao 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)