| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 17 Jun 2026 | SERC | Institute of Microelectronics | Process Integration Challenges in Heterogeneous Integration of XPU, HBM and Photonic Chiplets for AI/HPC Applications (Pending publish) | Lai Yee Chia, Tran Van Nhat Anh, San Sandra, Tai Chong Chai | 2026 IEEE 76th Electronic Components and Technology Conference (ECTC) |
| 10 Aug 2021 | SERC | Institute of Microelectronics | Heterogeneous Integration with Embedded Fine Interconnect | Chai Tai Chong, Lim Teck Guan, David Ho, Han Yong, Chong Ser Choong, Sharon Lim Pei Siang, Surya Bhattacharya | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |