| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 18 Mar 2024 | SERC | Institute of Microelectronics | Solutions for Process Challenges on Fan-Out Wafer Level Packaging of Electronic-Photonic Integration | Lai Yee Chia, Sajay Bhuvanendran Nair Gourikutty, Soon Wee Ho | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |