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Publication date Communities Collections Article title Author(s) Journal/Conference
30 Oct 2026 SERC Institute of Advanced Intelligence and Computing SWIFT-Place: Sequential Wirelength, Interposer Footprint, and Thermal-Aware Placement for 2.5D Advanced Packaging Systems (Pending publish) Yubo Hou, Sezin Ata Kircali, Gen Liang Lim, Richard Chang, Mihai Dragos Rotaru, Dutta Rahul, Ashish James 2026 International Symposium of Electronics Design Automation (ISEDA)
3 Aug 2023 SERC Institute of Microelectronics Development of PMUT Array Packaging from Characterisation Prototypes to Customer Samples Dominico Giusti, Alex Gritti, Fabio Quaglia, Alessandro Stuart Savoia, Hideyuki Sandoh, Gerald Klug, Hitoshi Hoshino, Dutta Rahul, Vempati Srinivasa Rao, David Ho Soon Wee, Masatoshi Wakahara, Mark Shaw 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute of Microelectronics Design and Development of High Density Fan-Out Wafer Level Package (HD-FOWLP) for Deep Neural Network (DNN) Chiplet Accelerators using Advanced Interface Bus (AIB) Mihai D. Rotaru, Wei Tang, Dutta Rahul, Zhengya Zhang 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)