Search results

Publication date Communities Collections Article title Author(s) Journal/Conference
24 Feb 2026 SERC Institute for Infocomm Research TDPNavigator-Placer: Thermal- and Wirelength-Aware Chiplet Placement in 2.5D Systems Through Multi-Agent Reinforcement Learning (Pending publish) Yubo Hou, Furen Zhuang, Partha Pratim Kundu, Sezin Ata Kircali, Jie Wang, Mihai Dragos Rotaru, Dutta Rahul, Ashish James 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics Development of PMUT Array Packaging from Characterisation Prototypes to Customer Samples Dominico Giusti, Alex Gritti, Fabio Quaglia, Alessandro Stuart Savoia, Hideyuki Sandoh, Gerald Klug, Hitoshi Hoshino, Dutta Rahul, Vempati Srinivasa Rao, David Ho Soon Wee, Masatoshi Wakahara, Mark Shaw 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute of Microelectronics Design and Development of High Density Fan-Out Wafer Level Package (HD-FOWLP) for Deep Neural Network (DNN) Chiplet Accelerators using Advanced Interface Bus (AIB) Mihai D. Rotaru, Wei Tang, Dutta Rahul, Zhengya Zhang 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)