| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 3 Aug 2023 | SERC | Institute of Microelectronics | Development of PMUT Array Packaging from Characterisation Prototypes to Customer Samples | Dominico Giusti, Alex Gritti, Fabio Quaglia, Alessandro Stuart Savoia, Hideyuki Sandoh, Gerald Klug, Hitoshi Hoshino, Dutta Rahul, Vempati Srinivasa Rao, David Ho Soon Wee, Masatoshi Wakahara, Mark Shaw | 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |
| 10 Aug 2021 | SERC | Institute of Microelectronics | Design and Development of High Density Fan-Out Wafer Level Package (HD-FOWLP) for Deep Neural Network (DNN) Chiplet Accelerators using Advanced Interface Bus (AIB) | Mihai D. Rotaru, Wei Tang, Dutta Rahul, Zhengya Zhang | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |