Development of PMUT Array Packaging from Characterisation Prototypes to Customer Samples

Development of PMUT Array Packaging from Characterisation Prototypes to Customer Samples

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

10.1109/ECTC51909.2023.00246

http://dx.doi.org/10.1109/ectc51909.2023.00246

Dominico Giusti, Alex Gritti, Fabio Quaglia, Alessandro Stuart Savoia, Hideyuki Sandoh, Gerald Klug, Hitoshi Hoshino, Dutta Rahul, Vempati Srinivasa Rao, David Ho Soon Wee, Masatoshi Wakahara, Mark Shaw

03 August 2023

Giusti, D., Gritti, A., Quaglia, F., Savoia, A. S., Sandoh, H., Klug, G., Hoshino, H., Rahul, D., Rao, V. S., Wee, D. H. S., Wakahara, M., & Shaw, M. (2023, May). Development of PMUT Array Packaging from Characterisation Prototypes to Customer Samples. 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC). https://doi.org/10.1109/ectc51909.2023.00246

PMUT (Piezoelectric Micromachined Ultrasonic Transducers) can be used in a wide number of medical and industrial applications, from high-end ultrasound scanning which requires a large array of membranes and interconnects to the ASIC driver/receiver, to therapeutic ultrasound and energy delivery which require a small number of membranes/interconnects. Different packaging needs have been required during the development program for the characterisation of the PMUT devices and the requirements of the different prospective product niches. In this paper, the different packages designed, assembled, and used during the development of the PMUT from the first characterisation packages to the 1st prototype packages that will be used for high resolution ultrasound imaging customer samples are described.

Publisher Copyright

There was no specific funding for the research done

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https://oar.a-star.edu.sg/communities-collections/articles/20258

2377-5726

Institute of Microelectronics