Citation:
Giusti, D., Gritti, A., Quaglia, F., Savoia, A. S., Sandoh, H., Klug, G., Hoshino, H., Rahul, D., Rao, V. S., Wee, D. H. S., Wakahara, M., & Shaw, M. (2023, May). Development of PMUT Array Packaging from Characterisation Prototypes to Customer Samples. 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC). https://doi.org/10.1109/ectc51909.2023.00246