Development of PMUT Array Packaging from Characterisation Prototypes to Customer Samples

Page view(s)
22
Checked on Jan 07, 2025
Development of PMUT Array Packaging from Characterisation Prototypes to Customer Samples
Title:
Development of PMUT Array Packaging from Characterisation Prototypes to Customer Samples
Journal Title:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
Keywords:
Publication Date:
03 August 2023
Citation:
Giusti, D., Gritti, A., Quaglia, F., Savoia, A. S., Sandoh, H., Klug, G., Hoshino, H., Rahul, D., Rao, V. S., Wee, D. H. S., Wakahara, M., & Shaw, M. (2023, May). Development of PMUT Array Packaging from Characterisation Prototypes to Customer Samples. 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC). https://doi.org/10.1109/ectc51909.2023.00246
Abstract:
PMUT (Piezoelectric Micromachined Ultrasonic Transducers) can be used in a wide number of medical and industrial applications, from high-end ultrasound scanning which requires a large array of membranes and interconnects to the ASIC driver/receiver, to therapeutic ultrasound and energy delivery which require a small number of membranes/interconnects. Different packaging needs have been required during the development program for the characterisation of the PMUT devices and the requirements of the different prospective product niches. In this paper, the different packages designed, assembled, and used during the development of the PMUT from the first characterisation packages to the 1st prototype packages that will be used for high resolution ultrasound imaging customer samples are described.
License type:
Publisher Copyright
Funding Info:
There was no specific funding for the research done
Description:
© 2023 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
ISSN:
2377-5726
Files uploaded:

File Size Format Action
post-print-development-of-pmut-array-packaging-from-characterisation-prototypes-to-customer-samples.pdf 2.74 MB PDF Request a copy