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Publication date Communities Collections Article title Author(s) Journal/Conference
18 Jun 2026 SERC Institute for Infocomm Research FAPlace: Joint Optimization of Chiplet Placement and Interposer Footprint for 2.5D Systems Yubo Hou, Sezin Kircali Ata, Gen Liang Lim, Richard Chang, Mihai Dragos Rotaru, Rahul Dutta, Ashish James Proceedings of the Great Lakes Symposium on VLSI 2026
24 Feb 2026 SERC Institute for Infocomm Research Cross-Domain Adaptation of Automated 3D X-Ray Defect Detection from HBM to Optical Transceivers Jie Wang, Richard Chang, Sajay Bhuvanendran Nair Gourikutty, Leong Ching Eva Wai, Yang Yu, Xulei Yang, Ramanpreet Singh Pahwa 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
24 Feb 2026 SERC Institute for Infocomm Research Generative AI-Powered Defect Detection for 3D X-Ray Microscopy Scans of High Bandwidth Memory Bumps Richard Chang, Jie Wang, Yang Yu, Meng Keong Lim, Ser Choong Chong, Ramanpreet Singh Pahwa, Xulei Yang 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
24 Feb 2026 SERC Institute for Infocomm Research AI-Powered Super-Resolution for Scalable and Efficient 3D X-Ray Inspection of 3D-Stacked HBMs Yang Yu, Kangkang Lu, Jie Wang, Richard Chang, Meng Keong Lim, Ser Choong Chong, Ramanpreet Singh Pahwa, Xulei Yang 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
26 Jun 2025 SERC Institute for Infocomm Research Efficient Visual Inspection Framework of High-Bandwidth Memory Bumps with Generative and Deep Learning AI Richard Chang, Jie Wang, Ser Choong Chong, Xulei Yang, Ramanpreet Singh Pahwa 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
26 Jun 2025 SERC Institute for Infocomm Research An Efficient Data Augmentation and Semantic Segmentation Framework for 3D Defect Detection of HBMs Yang Yu, Jie Wang, Richard Chang, Ser Choong Chong, Ramanpreet Singh Pahwa, Xulei Yang 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
2 May 2025 SERC Institute for Infocomm Research Artificial intelligence-enhanced 3D gait analysis with a single consumer-grade camera Ling Guo, Richard Chang, Jie Wang, Amudha Narayanan, Peisheng Qian, Mei Chee Leong, Partha Pratim Kundu, Sriram Senthilkumar, Sai Chaitanya Garlapati, Elson Ching Kiat Yong, Ramanpreet Singh Pahwa Journal of Biomechanics
11 Mar 2025 SERC Institute for Infocomm Research End-to-End Fast Segmentation Framework for 3D Visual Inspection of HBMs Jie Wang, Richard Chang, Meng Keong Lim, Ser Choong Chong, Xulei Yang, Ramanpreet Singh Pahwa 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)
26 Jun 2024 SERC Institute for Infocomm Research A Unified and Adaptive Continual Learning Method for Feature Segmentation of Buried Packages in 3D XRM Images Richard Chang, Wang Jie, Namrata Thakur, Ziyuan Zhao, Ramanpreet Singh Pahwa, Xulei Yang 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
18 Mar 2024 SERC Institute for Infocomm Research Efficient and Adaptive Semantic Segmentation of HBMs using Incremental Learning Richard Chang, Namrata Thakur, Jie Wang, Yurni Li, Ser Choong Chong, Ramanpreet Singh Pahwa 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)