GaN-on-Si HEMTs for Low Voltage FR2 Applications Enabled by Reactive-Sputtered n++-GaN Ohmic Contacts

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GaN-on-Si HEMTs for Low Voltage FR2 Applications Enabled by Reactive-Sputtered n++-GaN Ohmic Contacts
Title:
GaN-on-Si HEMTs for Low Voltage FR2 Applications Enabled by Reactive-Sputtered n++-GaN Ohmic Contacts
Journal Title:
IEEE Electron Device Letters
Keywords:
Publication Date:
30 March 2026
Citation:
Zhuang, Y., Liu, S., Xie, Q., Xie, H., Kazuyoshi, T., Kachi, T., Amano, H., Arulkumaran, S., & Ng, G. I. (2026). GaN-on-Si HEMTs for Low Voltage FR2 Applications Enabled by Reactive-Sputtered n++-GaN Ohmic Contacts. IEEE Electron Device Letters, 1. https://doi.org/10.1109/led.2026.3678989
Abstract:
This letter reports GaN-on-Si high-electron-mobility-transistors (HEMTs) employing reactive-sputtered Ge-doped n++-GaN ohmic contacts for low-voltage FR2 applications. A low sputtered n++-GaN/2DEG interfacial resistance of 0.06 Ω·mm is achieved for the InAlN/GaN heterostructure. The transistor achieves a low on-resistance of 0.91 Ω·mm and a maximum drain current of 2.03 A/mm, resulting in excellent output power of 0.51, 1.25, and 2.44 W/mm at VDS = 3, 5, and 8 V at 28 GHz, respectively. These results demonstrate the strong potential of RF GaN HEMTs employing sputtered n++-GaN ohmic contacts.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the A*STAR - White Space Manufacturing, Trade, and Connectivity Funding
Grant Reference no. : M23WSNG001

This research / project is supported by the A*STAR - Manufacturing, Trade, and Connectivity Industry Alignment Fund Pre-Positioning (IAF-PP)
Grant Reference no. : M22L3a0112
Description:
© 2026 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
ISSN:
0741-3106
1558-0563
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