Zhuang, Y., Liu, S., Xie, Q., Xie, H., Kazuyoshi, T., Kachi, T., Amano, H., Arulkumaran, S., & Ng, G. I. (2026). GaN-on-Si HEMTs for Low Voltage FR2 Applications Enabled by Reactive-Sputtered n++-GaN Ohmic Contacts. IEEE Electron Device Letters, 1. https://doi.org/10.1109/led.2026.3678989
Abstract:
This letter reports GaN-on-Si high-electron-mobility-transistors (HEMTs) employing reactive-sputtered Ge-doped n++-GaN ohmic contacts for low-voltage FR2 applications. A low sputtered n++-GaN/2DEG interfacial resistance of 0.06 Ω·mm is achieved for the InAlN/GaN heterostructure. The transistor achieves a low on-resistance of 0.91 Ω·mm and a maximum drain current of 2.03 A/mm, resulting in excellent output power of 0.51, 1.25, and 2.44 W/mm at VDS = 3, 5, and 8 V at 28 GHz, respectively. These results demonstrate the strong potential of RF GaN HEMTs employing sputtered n++-GaN ohmic contacts.
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Funding Info:
This research / project is supported by the A*STAR - White Space Manufacturing, Trade, and Connectivity Funding
Grant Reference no. : M23WSNG001
This research / project is supported by the A*STAR - Manufacturing, Trade, and Connectivity Industry Alignment Fund Pre-Positioning (IAF-PP)
Grant Reference no. : M22L3a0112