| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 10 Aug 2021 | SERC | Institute of Microelectronics | Comprehensive Study of Thermal Impact on Warpage Behaviour of FOWLP with Different Die to Mold Ratio | Ser Choong Chong, Simon Siak Boon Lim, Wen Wei Seit, Tai Chong Chai, Debbie Claire Sanchez | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |
| 25 Feb 2019 | SERC | Institute for Infocomm Research | Joint Optimization of Battery Energy Storage System and Fans for Frequency Reserve Capacities Allocation and Day-Ahead Energy Management | Katayoun Rahbar, Chin Choy Chai, Wuhua Hu | 2018 IEEE Region 10 Conference (TENCON) |