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Publication date Communities Collections Article title Author(s) Journal/Conference
18 Mar 2024 SERC Institute of Microelectronics Wafer Level Fabrication of Embedded Silicon Microcooler on Heating Devices Lau Boon Long, Javier Ong, Jason Au, Jong Ming Chinq, Zhang Xiaowu, Feng Huicheng 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
1 Sep 2015 SERC Institute of Microelectronics Stress Analysis and Design Optimization for Low-k Chip With Cu Pillar Interconnection Lin Jong-Kai, Au Keng Yuen, Hsiao Hsiang-Yao, Zhang Xiaowu, Che Fa Xing IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
13 May 2015 SERC Institute of Microelectronics Design and Optimization of Wafer-Level Compression Molding Process for One Chip Plus Multiple Decaps Bu Lin, Ho Siowling, S.D. Velez, Long Lau Boon, Jung Booyang, Chai Taichong, Zhang Xiaowu Components, Packaging and Manufacturing Technology, IEEE Transactions on
1 May 2015 SERC Institute of Microelectronics Package-Level Microjet-Based Hotspot Cooling Solution for Microelectronic Devices Yong Han, Lau Boon Long, Zhang Xiaowu IEEE Electron Device Letters