| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 18 Mar 2024 | SERC | Institute of Microelectronics | Polymer Based Dual Damascene Process for Fine Pitch RDL Advanced Packaging | Hsiao Hsiang-Yao, Ryan Ley, Peng Suo, Andy Yong Chang Bum, Roger Quon | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
| 18 Mar 2024 | SERC | Institute of Microelectronics | Development of Large RDL Interposer Package using RDL-first FOWLP Process | Soon Wee Ho, Siew Boon Soh, Boon Long Lau, Hsiao Hsiang-Yao, Vempati Srinivasa Rao | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
| 1 Sep 2015 | SERC | Institute of Microelectronics | Stress Analysis and Design Optimization for Low-k Chip With Cu Pillar Interconnection | Lin Jong-Kai, Au Keng Yuen, Hsiao Hsiang-Yao, Zhang Xiaowu, Che Fa Xing | IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY |