| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 1 Sep 2018 | SERC | Institute of Microelectronics | Cost-Effective Testing Solutions for Sealing Material with IR Package | Bu Lin, Jason Keng Yuen Au, Mian Zhi Ding, Vivek Chidambaram, Foo Wing Ng | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| 1 Oct 2016 | SERC | Institute of Microelectronics | 3-D Modeling and Characterization for Die Attach Process | Siow Ling Ho, Min Woo Rhee, Puay Fen Yong, Bu Lin, Leong Ching Wai | IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY |
| 13 May 2015 | SERC | Institute of Microelectronics | Design and Optimization of Wafer-Level Compression Molding Process for One Chip Plus Multiple Decaps | Bu Lin, Ho Siowling, S.D. Velez, Long Lau Boon, Jung Booyang, Chai Taichong, Zhang Xiaowu | Components, Packaging and Manufacturing Technology, IEEE Transactions on |