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Publication date Communities Collections Article title Author(s) Journal/Conference
17 Jun 2026 SERC Institute of Microelectronics High-Density, Energy-Efficient CPO Platform with PIC-in-Mold Interposer Architecture for AI/ML Data Centers (Pending publish) Sajay Bhuvanendran Nair Gourikutty, Wu Jiaqi, Zhonghua Yang, Mihai Rotaru, Ji Lin, Han Yong, Chia Lai Yee, Sharon Lim, San Sandra, Chai Tai Chong, Surya Bhattacharya 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
21 Apr 2025 SERC Institute for Infocomm Research Bayesian Optimization for Chiplet Placement on 2.5D System in Package Platforms: Tackling Rotation and Constraint Challenges Furen Zhuang, Partha Kundu, Sezin Ata, Yubo Hou, Mihai Rotaru, Rahul Dutta, Ashish James AI4X
3 Dec 2024 SERC Institute for Infocomm Research Efficient Thermal-Aware Floor-planning with Bayesian Optimization: A Simulation-Efficient Approach Furen Zhuang, Partha Kundu, Sezin Kircali, Yubo Hou, Mihai Rotaru, Rahul Dutta, Ashish James 26th Electronics Packaging Technology Conference (EPTC 2024)
28 May 2024 SERC Institute of Microelectronics Deep Reinforcement Learning-Based Power Distribution Network Design Optimization for Multi-Chiplet System Weiyang Miao, Zhen Xie, Chuan Seng Tan, Mihai Rotaru 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics Inverse prediction of capacitor multiphysics dynamic parameters using deep generative model Kart-Leong Lim, Rahul Dutta, Mihai Rotaru 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)