| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 26 Jun 2025 | SERC | Institute of Microelectronics | Novel Selective Metal Capping on Cu pad Enabling Void-Free Hybrid Bonding at Low Thermal Budgets, Irrespective of Cu Topography and Microstructure | Hemanth Kumar Cheemalamarri, Masahisa Fujino, Chandra Rao Bhesetti, Lau Boon Long, Mishra Dileep, Srinivasa Rao Vempati, Navab Singh | 2025 IEEE 75th Electronic Components and Technology Conference (ECTC) |
| 9 Dec 2024 | SERC | Institute of Microelectronics | Low-Thermal Budget TEOS-TEOS Bonding for Multi-Stack HBM Applications | Hemanth Kumar Cheemalamarri, Masahisa Fujino, Ji Hong Miao, Everline Teo, Vempati Srinivasa Rao, Navab Singh | 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) |