| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 26 Jun 2024 | SERC | Institute of Microelectronics | Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bonding | Hemanth Kumar Cheemalamarri, Arvind Sundaram, San Sandra, Tran Van Nhat Anh, Bhesetti Chandra Rao, Chen Gim Guan, Yu Haitao, Mani Raju, Luo Ping, Lee Chaeeun, Vempati Srinivasa Rao, Navab Singh | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |