| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 5 Mar 2026 | SERC | Institute of Microelectronics | Flip chip interconnects for quantum computing application: a comparison between tin-silver and indium bump | Norhanani Binte Jaafar, Daniel Lau, Hongyu Li, Yong Chyn Ng, Ya-Ching Tseng | Quantum Computing, Communication, and Simulation VI |
| 24 Feb 2026 | SERC | Institute of Microelectronics | 2.5D Cryogenic Packaging for Advanced Quantum Processors | Norhanani Binte Jaafar, Li Hongyu, Ya-Ching Tseng, Yong Chyn Ng, Daniel Lau | 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC) |
| 26 Jun 2024 | SERC | Institute of Microelectronics | Electrical Characterization and Reliability Studies of Nano-TSV | Ya-Ching Tseng, King-Jien Chui, Simon Chun Kiat Goh, Daniel Lau, Hongyu Li, Tran Van Nhat Anh, Haitao Yu, Chin Khang Tew, Gim Guan Chen, Binni Varghese, Calvin Chua Hung Ming | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |