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18 Mar 2024 SERC Institute of Microelectronics Reliability Assessment of 2.5D Module using Chip to Wafer Hybrid Bonding Ser Choong Chong, Jason Au Keng Yuen, Vasarla Nagendra Sekhar, Ismael Cereno Daniel, Mishra Dileep Kumar, Vempati Srinivasa Rao 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Development of Chip to Wafer Assembly with CuSnAg Microbump on Solder on Pad Interposer using Thermocompression and Solder Reflow Jason Au Keng Yuen, Ser Choong Chong, Ismael Cereno Daniel 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics Development of 4 die stack module using Hybrid bonding approach Ser Choong Chong, Jason Au Keng Yuen, Vasarla Nagendra Sekhar, Ismael Cereno Daniel, Vempati Srinivasa Rao 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
1 Sep 2015 SERC Institute of Microelectronics Stress Analysis and Design Optimization for Low-k Chip With Cu Pillar Interconnection Lin Jong-Kai, Au Keng Yuen, Hsiao Hsiang-Yao, Zhang Xiaowu, Che Fa Xing IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY