| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 11 Mar 2025 | SERC | Institute of Microelectronics | Assembly of Multi-Device Power Package with Clips as Interconnects | Leong Ching Wai, Yi Xuan Yeo, Jacob Jordan Soh, Gongyue Tang | 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) |