| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 5 Jan 2022 | SERC | Institute of Microelectronics | Addressing the assembly challenges of Antenna-in-package | Sharon Pei Siang Lim, Ser Choong Chong, David Ho Soon Wee, Wen Wei Seit, Jacob Jordan Soh, Tai Chong Chai | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |