| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 18 Mar 2024 | SERC | Institute of Microelectronics | Investigation of Void-free Chip-to-Chip Bonding Methods for CMOS-MEMS Compatibility | Yi Xuan Yeo, Eva Leong Ching Wai, Daniel Ssu-Han Chen, Ser Choong Chong | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
| 9 Oct 2023 | SERC | Institute of Microelectronics | MEMS-Silicon Chip Bonding Verification using GHz Pulse-echo Simulation and Measurements | Shyam Trivedi, Yi Xuan Yeo, Mantalena Sarafianou, Eva Leong Ching Wai, Jaibir Sharma, Daniel Ssu-Han Chen, Amit Lal, Kevin Tshun Chuan Chai | 2023 Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium (EFTF/IFCS) |