Wai, L. C., Yeo, Y. X., Soh, J. J., & Tang, G. (2024). Assembly of Multi-Device Power Package with Clips as Interconnects. 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC), 479–482. https://doi.org/10.1109/eptc62800.2024.10909807
Abstract:
High heat dissipation design is crucial for high power
devices to prevent overheated occurring on the devices during
operation. To package a multi-devices module with metal
clips can improve heat dissipation through large metal clip
surface. However, to assemble a multi-chip module with a
total 12 pcs of clips in this study is challenging. In this study,
clips shift causing short to adjacent clips after reflow process
was observed initially, after the approach of using a proper jig,
clips horizontally shift issuers was resolved, and planarity of
the clips reduced from ~600μm to ~200 um. Pressure sintered
silver (Ag) paste used also achieved shear strength of more
than 20Mpa.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the Science and Engineering. Research Council of A*STAR - NA
Grant Reference no. : A20H9a0242