Feng, H., Tang, G., Zhang, X., Lau, B. L., & Jong, M. C. (2025). Two-Phase Liquid Cooling With Backside-Embedded Micro-Pin Fins for High-Power Microelectronics. In (Editor), 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc67330.2025.11392139
Abstract:
Future miniaturization of high-power electronics requires effective cooling technologies. Thereby, this study experimentally investigates an embedded two-phase liquid cooling solution. A thermal test vehicle (TTV) is fabricated with micro-pin fins embedded on the chip backside. A thin-film metal heater and two resistance temperature detectors (RTDs) are deposited on the chip active side to apply power and monitor temperatures. The TTV is tested in a custom closed-loop cooling setup under various conditions. The results show that the heat transfer coefficient increases with chip heat power and reaches up to 40,000 W/m2⋅ K, the junction-to-ambient thermal resistance reduces and reaches a minimal value of 0.25 K/W; COP achieves optimal values as flowrate increases. The system dissipates heat powers up to 187 W, with the corresponding heat flux 187 W/cm2. In the two-phase regime, the temperatures and pressures fluctuate due to vapor generation. These findings demonstrate the feasibility of current method for high-power electronics cooling and underscore the need for further studies on boiling dynamics.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the Agency for Science, Technology and Research (A*STAR) - Council Strategic Fund
Grant Reference no. : C210415009
This research / project is supported by the Agency for Science, Technology and Research (A*STAR) - Applied Centre of Excellence in Advanced Packaging 3.0
Grant Reference no. : I2101E0008