Wang, J., Chang, R., Gourikutty, S. B. N., Wai, L. C. E., Yu, Y., Yang, X., & Pahwa, R. S. (2025). Cross-Domain Adaptation of Automated 3D X-Ray Defect Detection from HBM to Optical Transceivers. In (Editor), 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc67330.2025.11392412
Abstract:
The inexorable trend towards heterogeneous integration in high-bandwidth optical transceivers presents a formidable challenge for in-line metrology and yield enhancement. This work introduces a novel, end-to-end automated inspection framework leveraging high-resolution X-ray computed tomography to overcome the limitations of conventional surface-based techniques. Our dataset consists of 3D X-ray scans of diced packages from 300 mm reconstituted wafers, each integrating silicon photonics integrated circuits, electronic integrated circuits, through-mold interconnects, and multi-layer redistribution layers, encapsulated within epoxy mold compounds. Traditional inspection methods, such as optical microscopy and electrical testing, are fundamentally blind to critical buried defects like solder voids at micro-bump interfaces, pad misalignment, and other related defects. Our automated workflow addresses this critical visibility gap.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the A*STAR - Manufacturing, Trade, and Connectivity Programmatic Fund
Grant Reference no. : M23L7b0021