Long, L. B., Ong, J., Au, J., Chinq, J. M., Xiaowu, Z., & Huicheng, F. (2023, December 5). Wafer Level Fabrication of Embedded Silicon Microcooler on Heating Devices. 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc59621.2023.10457612
Abstract:
The demand for cooling performance on microelectronics
package is in increasing trend due to the complexity of multi- chips packaging design and enhanced
chips performances. This paper demonstrated the wafer level fabrication of embedded silicon heat
sink and silicon-based liquid microchannel on metallic heating and sensing device. This thermal
management solutions was designed to achieve high heat dissipation. 3.6um thick of metallic heater
and sensor was used to deliver high power flow and direct embedded liquid cooling channel was
fabricated at the opposite site of heating devices. Wafer level fabrication process integration
flow was established. Process feasibility challenges issues and defectivities incurred were
addressed. The respective solutions or process parameters
optimization were discussed in this paper.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the A*STAR - Embedded Two-Phase Liquid Cooling on 3D Ics
Grant Reference no. : C210415009